Feeding of Submillimeter Microparts Along an Asymmetric Fabricated Surface by Double-Pulsed Femtosecond Laser Process

We previously showed that microparts can be fed along a saw-toothed surface using simple planar symmetric vibrations. Microparts move forward because they adhere to the saw-toothed surface asymmetrically. We used saw-toothed silicon wafers fabricated by a dicing saw applying bevel type blades. We then studied the movement of 2012-type capacitors (size:2.0× 1.2× 0.6 mm, weight:7.5 mg) and 0603-type capacitors (size:0.6× 0.3× 0.3 mm, weight:0.3 mg). In this study, we assessed the movement of smaller 0402-type capacitors (size:0.4× 0.2× 0.2 mm, weight:0.1 mg). A femtosecond laser process was used to fabricate an asymmetric surface. The characteristics evaluated were the differences in profiles of both inclined surfaces, the effect of adhesion decrease, and the friction angle of the 0402-type capacitors in both directions. Using the results of feeding experiments of these capacitors, we assessed the relationship between driving frequency and feeding velocity.